In recent years, green energy conservation has become a central focus in global development. As the world continues to search for more efficient and energy-saving lighting solutions, traditional light sources are gradually being replaced. Among these alternatives, LED technology stands out as the most promising option. In particular, the use of high-brightness LEDs in various lighting applications has seen continuous and rapid growth. One of the key innovations driving this expansion is the introduction of laser wafer scribing in LED manufacturing. This technique has enabled LEDs to be widely used in LCD backlights for devices such as smartphones, televisions, and touchscreens. Perhaps the most exciting application is the use of white LEDs in general lighting, offering energy efficiency and long-lasting performance.
Laser scribing offers significant advantages over traditional mechanical methods. The scribe lines produced by lasers are much narrower, which greatly improves material utilization and increases production efficiency. Additionally, laser processing is a non-contact method, eliminating the risk of microcracks and other damage that often occurs with mechanical cutting. This results in better wafer integrity, higher output efficiency, and improved reliability of the final LED products.
One of the main challenges in LED manufacturing involves cutting hard and brittle materials like single-crystal sapphire (Al₂O₃) and gallium nitride (GaN), which have tensile strengths comparable to steel. Conventional mechanical sawing can cause chipping, microcracking, and delamination, requiring wider spacing between individual LED chips to prevent damage. This not only reduces yield but also lowers overall efficiency.
Laser scribing provides a superior alternative. It allows for precise, narrow cuts without physical contact, making it ideal for brittle semiconductor materials like gallium arsenide (GaAs). The typical scribe depth achieved with lasers is about one-third to one-half the thickness of the substrate, enabling clean and controlled fracture surfaces. High-speed scribing is possible while maintaining precision, which requires lasers with excellent characteristics such as short pulse widths, high beam quality, high peak power, and high repetition rates. These features make laser scribing an essential process in modern LED fabrication, ensuring both efficiency and quality in mass production.
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