In recent years, green energy conservation has become a central focus in global development. As the world continues to search for more efficient and energy-saving lighting solutions, traditional light sources are gradually being replaced. Among these alternatives, LED technology stands out as the most promising option. The application of high-brightness LEDs in lighting has seen continuous and rapid growth. One of the key innovations driving this progress is the use of laser wafer scribing in LED manufacturing. This technique has enabled LEDs to be widely used in LCD backlights for devices such as smartphones, televisions, and touchscreens. Perhaps the most exciting development is the growing use of white LEDs in general lighting applications.
Laser scribing offers significant advantages over conventional mechanical methods. Unlike traditional cutting tools, which leave wide scribe lines, laser scribing produces much narrower lines. This leads to improved material utilization and higher output efficiency. Additionally, since laser processing is a non-contact method, it minimizes damage such as microcracks and chipping on the wafer. This results in better alignment of particles, increased productivity, and enhanced reliability of the final LED products.
LEDs are typically made from hard and brittle materials like single-crystal sapphire (Al₂O₃) and gallium nitride (GaN), which have tensile strengths comparable to steel. Cutting these materials with traditional mechanical saws often causes issues like chipping, microcracking, and delamination. To prevent damage, wider gaps must be left between individual LED chips, reducing the overall efficiency of the wafer.
Laser processing, on the other hand, allows for precise and clean cuts without physical contact. This makes it ideal for cutting delicate materials like gallium arsenide (GaAs) and other compound semiconductors. In LED wafer processing, the typical scribe depth is about one-third to one-half of the substrate thickness, enabling clean and controlled separation. The process can achieve narrow and deep scribe lines at high speeds, which requires lasers with excellent characteristics—such as narrow pulse width, high beam quality, high peak power, and high repetition rate.
For more information on how laser scribing enhances LED production, visit the official website.
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