This time, we mainly want to write this boundary condition of the positive silver and the judgment criteria of each key node. Then we will have a set of criteria and reasonable explanations for the framework system and various issues that should be followed, and of course this system is only For the sake of my family, I write here to discuss and verify with everyone in order to identify the truth and benefit everyone.
Positive silver as the front electrode If there is a big principle, then there is only one that is to minimize the damage to the battery itself under the premise of meeting the conduction. From this principle, we will introduce as few damages as possible. One is that the coverage area should be less corresponding to the grid lines. At present, everyone thinks that this is basically the limit of screen printing, but it has been a great challenge from the metallization conference. There is no speculation to look at it yet, and it is possible to reduce it by half on the basis of the current situation. We will wait and see. The other aspect is the ohmic contact problem that has been discussed for everyone under the gate line, and it is also where everyone makes a fuss.
For this ohmic contact problem, we have another criterion to judge. That is, under the premise of satisfying this ohmic contact, the number of nano-colloid channels below that gate line is also as small as possible. This is also the principle of minimizing the damage to the battery when meeting the premise. How can we judge this as little as possible? When we can't derive from a complicated semiconductor formula, there is an easy way to do this. Take DuPont's products as a standard, pull that gate line off with a ribbon, take a close look at your product, and DuPont products corrosion of silicon wafers, domestic companies rely on this point to adjust the process on site.
To meet the principle of least silver nanocolloid channels, each nanocolloid channel must have strong conductivity and be evenly distributed. Even distribution is a problem in your manufacturing process. However, the strong conductivity is a problem of how much silver nanocolloid particles are. The premise of this problem will evolve to the problem of the ability of the glass system to dissolve silver. That is, the ability to dissolve silver is necessarily a prerequisite, and it is also the reason for the continuous change of the glass system. With this premise, you will have problems controlling the particle size and abnormal crystal growth of the cooling section later. As long as your system has good silver solubility and can effectively control the size and distribution of colloidal particles while cooling down while suppressing the abnormal growth of crystalline particles, then you basically make a good positive silver. For ohmic contact, another issue to be discussed is the problem of the fifth main group impurity, which cannot be achieved by positive silver in the current battery type, and it is in the absence of a passivation layer for Ebola's silver-silver alloy principle. The light on the film can be achieved.
The above discussion is basically the boundary conditions of positive silver. Let's take a look at the judgment criteria and explanations of various phenomena at each key node.
For the issue of sliver thin lines, many times we have high current and high series resistance. For high currents, your line can be achieved as much as fine as DuPont. Of course, the ohmic contact under your gateline should not be too bad. . On the premise that the current is the same as the width of the gate lines, who does the series resistance is good to explain who is really good ohmic contact control technology, and also represents the technical level of æ£é“¶ itself. In the discussion in this area, we will discuss on the premise of the same width of the grid lines. A good ohmic contact shows a small open-circuit voltage, and if it is a high-voltage serial connection, it is the problem that your channel of silver nano-colloids is not enough or the channel has insufficient conductivity, how to judge it? Or use that tape to open the microscope.
At the same time there will be a series of high impedance and low pressure, this can basically be judged as a problem of excessive corrosion. In other words, the number of silver nano-colloid channels and the strength of the channel conductivity is a key factor. This key corresponding glass is the ability to dissolve silver, control the formation of silver colloid, and control the corrosion of silicon nitride. The evolution of the glass system took into account these two points. Until now, the so-called scorpion technology seems to satisfy these two points well. The control of silicon nitride corrosion depends on the corrosion ability and high temperature flow characteristics of the glass system itself. There is no quantification standard for the corrosion ability. DuPont products can only be used as the standard. For high-temperature flow characteristics, different corrosion ability glass systems must be followed. This high-temperature flow characteristic is only described in a patent in 2008. However, the rest of the time was spent on the glass formulation system. The description of the high-temperature flow characteristics can be used as a criterion for glass system development.
One of the key characteristics of glass is the ability to dissolve silver and silver colloidal particles, because the current silver is based on the principle of silver nanocolloid conduction. Let's say a little more. Whether the ability to dissolve silver is a key issue, everyone has a dispute in the group, and the dispute has become a problem of abnormal growth of crystal grains in the later period. That is, lead glass tends to cause the cooling section of silver colloid particles to grow and decrease in quantity. If the length is too large, it will cause The battery is damaged, and the lead-antimony glass does not seem to grow abnormally in the cooling section of this colloidal particle.
For this reason, I can only say that we are talking about the issue of positive silver at different stages, instead of using this temperature-reducing segment to negate the issue of the precondition for the ability to dissolve silver. Since the use of silver nano-colloids as the principle of conduction, then first of all, only you can melt into a lot of silver glass itself is possible to achieve this silver nano-colloid conductive, you can not dissolve much silver, even if the control of how to prevent growth later are not use. For the imitation of this colloidal particle growth control size, we look at the principle of the traditional silver nanocolloid coloring, which is very clear about how to control this. The reason why I repeatedly praised the silver dissolution ability of these evidence.
At this time, we look at the problem of a change in the sintering process, from the previous low-temperature slow burning to the current high-temperature fast burning, this one can be sure that meet the major premise of the principle of minimum battery damage. From the silver paste itself, there is no problem in doing a low-temperature fast burning, and it does save energy. Why did we take a high-temperature fast-burning route? I only explained from the perspective of the solubility of silver, that is, solubility. It is directly related to temperature. High-temperature-dissolving silver multi-ohmic contact is good, and low-temperature fast-burning silver paste inevitably requires the use of ultra-fine silver powder and ultra-low softening point glass. Everyone knows that ultra-fine silver powder is contained in the case of high silver solid content. It is difficult to print, and the ultra-fine silver powder is also difficult to be wetted by the viscosity of the glass at a low temperature, and the solubility at low temperatures is also low, so that these constraints make it impossible to perform the low-temperature rapid firing of silver.
From the perspective of silver, high-temperature rapid burning can be used to a certain extent, in which slightly lower activity silver powder can be used. Such silver powder is slowly sintered and wetted by the glass and dissolved in a large amount to facilitate ohmic contact. The fine silver powder has high sintering activity because of its own firing of crystalline Diffusion is good, and the glass is hard to be eroded. From this point of view, if your channel number is good and the glass-silver-reducing capacity is not problematic, you can adjust the silver particle size so that the silver powder is easily dissolved.
The traditional silver nanocolloidal colored silver is introduced in the form of silver salt or silver oxide, since the silver must be dissolved in the form of silver ions to be dissolved. Although DuPont's patents each time introduce various types of silver salt introduction, it is still difficult to introduce silver salts in normal silver, because the fluidity of your slurry is not well controlled, and the silver oxide is easy to handle due to excessively high temperatures. It is reduced to silver by itself, so in the end it is adjusted by glass.
Let's take a look at this Korea University. This country that uses the Tai Chi flag to make it clear that we understand Tai Chi and say that we like to study from the perspective of Qi. It concludes that the high oxygen environment is conducive to the dissolution of silver. So, let's take a look at the reason why the lead tellurium until the lead vanadium vanadium glass is reasonable, the molar amount of oxygen in the high lead glass is actually very small, and the oxygen in the yttrium oxide is increased, and the yttrium itself is also an oxygen element, and then the vanadium is introduced again. The molar amount of Mo is greatly increased and this vanadium itself can release oxygen at a high temperature, so the rationality of this glass system is explained.
The metallization meeting also discussed other frontal metallization forms. What exactly will this silver and other metallizations do? It all depends on the form of the ultimate cheap Internet battery. It was only a phased form before this.
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